Product sheet
The GS600 series is a high-precision in-line jet dispensing machine designed for semiconductor packaging manufacturers FCCSP, SiP and FCBGA who demand perfect control of the capillary underfill (CUF) process.
It combines Mingseal's own piezoelectric jetting system with a dual-lane in-line configuration. Compatible with clean-room operation, it offers a small footprint that optimises clean-room space. It dispenses ultra-low adhesive volumes, down to 0.001 mg per dot, for precise underfill with minimal voids, essential for new-generation chips. It is available as a stand-alone version with manual loading and unloading, or with a fully automated handler or in-line connection to integrate into existing SMT and SiP lines.
Micro-volume underfill with remarkable dot consistency.
Higher throughput (UPH) on a smaller floor area.
Real-time adhesive weight monitoring, bottom heating and vacuum hold-down of the substrate.
Designed for semiconductor clean rooms where space is at a premium.
Compatible with semiconductor MES systems and standard communication protocols, for smart traceability.
The GS600SUA works with a fully automated in-line dispensing flow, optimised for high-precision capillary underfill.
PCBs or substrates enter via the dual-lane conveyor. Each lane can process a different product at the same time, with automatic orientation checking to avoid loading errors.
The vision system locates the fiducials and compensates X/Y position and rotation in real time, for sub-pixel alignment before dispensing.
The heated table brings the substrate to the optimum temperature (up to 180 °C): the underfill viscosity drops and capillary flow under the chip improves.
The piezoelectric jetting system dispenses down to 0.001 mg per dot, at a frequency of up to 1,000 Hz, along the programmed paths.
After dispensing, the precision scale (0.1 mg) checks the actual adhesive weight and corrects automatically to keep doses constant.
Substrates leave via the conveyor towards the next station. Triple low-level alarm and automatic cleaning of adhesive residue for continuous production.
For FCBGA and SiP packaging, several criteria are essential:
Accuracy: for fine-pitch FCBGA and SiP components, aim for a repeatability of ± 0.003 mm (X/Y) and an accuracy of ± 0.010 mm or better. The GS600SUA reaches this level.
Jetting performance: the minimum dot weight (0.001 mg) and maximum frequency (1,000 Hz) determine throughput and quality. Check that the jet handles your adhesive viscosity, up to 200,000 cps.
Lane configuration: dual lane allows parallel processing and doubles the throughput. Check that the adjustable width (60 to 162 mm) covers your substrates and trays.
Clean-room compatibility: Class 100 (ISO 5) or Class 10 (ISO 4), with suitable FFU filtration.
Process control: real-time adhesive weight calibration (± 3% / 1 mg), bottom heating (up to 180 °C, ± 1.5 °C) and vacuum hold-down of the substrate to aim for zero defects.
Automation: MES connection, SMEMA interfaces and automatic loading/unloading modules to integrate into existing SMT and packaging lines.
| Cleanliness | |
| Work area cleanliness | Class 100 (ISO 5) Class 10 (ISO 4) |
| Motion system | |
| Drive | X/Y: linear motor Z: servomotor + screw module |
| Repeatability (3σ) | X/Y: ± 0.003 mm — Z: ± 0.005 mm |
| Positioning accuracy (3σ) | X/Y: ± 0.010 mm — Z: ± 0.015 mm |
| Maximum speed | X/Y: 1,000 mm/s — Z: 500 mm/s |
| Maximum acceleration | X/Y: 1 g — Z: 0.5 g |
| Optical scale resolution | 1 µm |
| Z-axis travel (W × D) | 350 × 470 mm |
| Z height calibration and compensation | Laser sensor |
| Laser sensor accuracy | 2 µm |
| Dispensing system | |
| Adhesive control accuracy | ± 3 % / 1 mg |
| Dot position repeatability (CPK > 1.0) | ± 25 µm |
| Minimum nozzle diameter | 30 µm |
| Minimum dot weight | 0.001 mg/dot |
| Maximum fluid viscosity | 200,000 cps |
| Maximum jet frequency | 1,000 Hz |
| Channel / nozzle heating temperature | Ambient to 200 °C |
| Channel / nozzle temperature deviation | ± 2 °C |
| Compatible adhesive packaging | 5 / 10 / 30 / 50 / 70 cc |
| Syringe cooling | Down to 15 °C below ambient temperature |
| Piezo cooling | Down to compressed-air temperature |
| Conveyor | |
| Number of lanes | 2 |
| Number of belt sections | 1 (single piece) |
| Maximum conveying speed | 300 mm/s |
| Maximum load carried | 3 kg |
| Minimum edge clearance | 3 mm |
| Adjustable lane width | 60 to 162 mm |
| Width adjustment | Manual |
| Conveyor height | 910 to 960 mm, adjustable |
| Max. substrate / tray thickness | 6 mm |
| Substrate / tray length | 60 to 325 mm |
| Vacuum suction pressure | −50 to −80 kPa (adjustable) |
| Bottom heating | Ambient to 180 °C |
| Heating temperature deviation | ≤ ± 1.5 °C |
| Installation | |
| Footprint (W × D × H) | 2,380 × 1,550 × 2,080 mm (loading, unloading and screen included) 2,380 × 1,200 × 2,080 mm (loading and unloading included, screen excluded) |
| Weight | 1,600 kg |
| Power supply | 200 to 240 V AC, 47 to 63 Hz (single-phase) |
| Current | 30 A |
| Power | 6.4 kW |
| Compressed air | 0.5 MPa, 450 L/min × 2 |
Trials on your own substrates and fluids can be carried out in our laboratory. Discover our testing services
Let's talk about your application
Tell us which fluid you dispense, at what rate and with what tolerance: we will propose the right configuration, a detailed quotation and, if you wish, a trial on your own parts in our laboratory.
CDS Electronique · Bussy-Saint-Martin (77) · Mon–Thu 9am–6pm · Fri 9am–12pm
