FS600A/F — Dual-head in-line vision dispensing robot for underfill

MingsealLab trial availableInstallation and trainingCDS technical support

Brand: Mingseal
Model: FS600A/F
Structure: In-line, dual head / dual stage
Dispensing area: 400 × 520 mm
Repeatability: X/Y ± 0.01 · Z ± 0.015 mm
Conveying: 300 mm/s
Price: On request

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Trials on your partsFluid and process validation in our Demo-Lab in Bussy-Saint-Martin.

Installation and trainingCommissioning, adjustments and hands-on training by our technicians.

Technical supportA team in France for set-up, troubleshooting and follow-up.

Consumables and partsNeedles, syringes and wear parts for your production runs.

Detailed information Product description

Detailed information

BrandMingseal

ModelFS600A/F

CertificationCE · ISO

Voltage110 V / 220 V

Dimensions770 × 1,200 × 1,450 mm

Dispensing area400 × 520 mm

Repeatability (3σ)X/Y ± 0.01 · Z ± 0.015 mm

Max. speedX/Y 1,300 — Z 500 mm/s

FieldsSMD, FATP, VCM, MiniLED

ApplicationsBGA/CSP/Flip-Chip underfill, SMD bonding

Product description

The FS600A/F is a fast, precise and cost-effective in-line vision dispensing machine designed for chip underfill and electronic component assembly in the SMT, FATP, VCM and MiniLED industries. Its dual-head / dual-station operation allows continuous dispensing on two carriers at the same time: compared with a single-lane machine, parallel production significantly increases throughput (UPH) and reduces idle time between parts.

Bottom heating, recirculation dispensing, in-line weighing and an optional vacuum tray ensure good adhesive flow, stable dot sizes and consistent bonding, even for underfill of very small gaps and fragile components.

Features and benefits

Dual lane, dual station

Synchronous parallel dispensing on two carriers, for high-volume SMT and underfill lines.

High speed and high precision

Optical scales and linear motors for precise, stable dispensing; the mineral frame absorbs vibrations caused by fast movements.

Vision alignment and full inspection

Position automatically corrected in real time, inspection of the product before dispensing and of the adhesive after.

Controlled underfill process

Bottom heating (option) improves wetting and adhesive flow into narrow gaps.

Fast changeover and MES

Fast model change; connection to the MES to report production status in real time, raise alerts and trace any anomaly.

Modular design

In-line modules, dual lane, dual head, T/R, bottom heating, weighing, loading and unloading according to your process.

Main modules

T/R module

Suited to side dispensing processes.

Conveying module

Positioning and conveying of products, in single or dual lane as required.

Optional configurations

Automatic loading / unloading Synchronised dual head Asynchronous dual head Waiting zone and bottom heating Integrated weighing Parallel dual-lane operation Vacuum suction block Laser height measurement Fluid level alarm Code reading identification

Technical specifications

Dimensions (W × D × H) excluding loading/unloading	770 × 1,200 × 1,450 mm	Dispensing area (W × D) excluding loading/unloading	400 × 520 mm
Repeatability (3σ)	X/Y: ± 0.01 mm — Z: ± 0.015 mm	Positioning accuracy (3σ)	X/Y: ± 0.015 mm — Z: ± 0.025 mm
Maximum speed	X/Y: 1,300 mm/s — Z: 500 mm/s	Maximum acceleration	X/Y: 1.3 g — Z: 0.5 g
Max. conveying speed	300 mm/s	Max. carrier load	3 kg
Max. carrier tray thickness	10 mm	Min. edge clearance	3 mm
Max. product dimensions	L 280 × W 180 × H 180 mm	Voltage	110 V / 220 V
Certification	CE · ISO

Typical applications

Chip underfill (BGA, CSP, Flip-Chip)

Bonding of SMD and passive components

Reinforcement of micro-electronic modules

Corner bonding and PCB edge sealing

In-line weighing of adhesive dots and process monitoring

Handling of fragile substrates by vacuum suction

Compatible processes

Underfill SMD encapsulation Dam & Fill PUR adhesive for mid-frames Lens bonding Component reinforcement on FPC Dust-trap adhesive Vent bonding Solder paste dispensing Metal dome bonding

Trials on your own parts and fluids can be carried out in our laboratory. Discover our testing services