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FS200A, Mingseal dual-head in-line vision dispensing robot

FS200A — High-precision dual-head in-line vision dispensing robot

MingsealLab trial availableInstallation and trainingCDS technical support
Brand
Mingseal
Model
FS200A
Structure
In-line, two independent heads
Dispensing area
330 × 205 mm 
Repeatability
X/Y/Z ≤ ± 10 µm
Conveyor
1 or 2 lanes, 40 – 205 mm
Price
On request
Trials on your partsFluid and process validation in our Demo-Lab in Bussy-Saint-Martin.
Installation and trainingCommissioning, adjustments and hands-on training by our technicians.
Technical supportA team in France for set-up, troubleshooting and follow-up.
Consumables and partsNeedles, syringes and wear parts for your production runs.
Detailed information Product description

Detailed information

BrandMingseal
ModelFS200A
CertificationCE · ISO
FieldsCCM, VCM, FPC, MiniLED, SMD
Repeatability (3σ)X/Y/Z ≤ ± 10 µm
AccuracyX/Y/Z ≤ ± 15 µm
Max. speedX/Y 1,300 — Z 500 mm/s
Camera field25.4 × 25.4 mm
Height measurement± 5 mm, repeatability 1 µm
ConveyorSingle or dual lane, 40 – 205 mm

Product description

The Mingseal FS200A is a high-precision dual-head in-line vision dispensing machine designed for demanding manufacturers of camera modules, autofocus motors, flexible circuits, MiniLED encapsulation and SMD assembly. It combines high-resolution motion, syringe feed with optional heating sleeves, fast valve or pump dispensing, integrated vision alignment and recipe storage with MES and PLC interfaces.

Highlights

Better yield thanks to smart AOI

Consistent shape, volume and position of deposits on every part.

Two independent heads

Two heads for two different materials (epoxy, UV adhesive, solder paste) or synchronised dual-dot dispensing.

No line stoppage

Separate-lane design: if one module is under maintenance, the rest of the line keeps producing.

Ready for automation

Continuous, automated flow, with simple recipe changes from one product to the next.

Single or dual-lane conveyor

Stand-alone batch production or seamless integration into an existing high-speed line.

The problem

On camera modules, defects often come from irregular adhesive volume or misaligned deposits, leading to rework and lower yield.

The cause

Manual dispensing, unstable fluid viscosity, insufficient alignment or motion resolution: volume and position vary.

The FS200A answer

Precise motion, temperature-controlled syringe feed, fast dispensing and vision alignment stabilise the volume and position of deposits.

Technical specifications

Application areasCamera modules (CCM), autofocus motors (VCM), flexible circuits (FPC), MiniLED and SMD
ProcessesUnderfill, SMD encapsulation, PUR adhesive for mid-frames, Dam & Fill, component reinforcement on FPC, lens bonding, vent bonding, dust-trap adhesive, metal dome bonding, solder paste dispensing, chip potting
Motion systemX/Y: linear motor
Z: servomotor + screw module
Optical scale: 0.5 µm resolution
Max. dispensing area (X × Y)330 × 205 mm (single lane)
330 × 170 mm (dual lane)
Working travel (X × Y)600 × 700 mmRepeatability (3σ)X/Y: ≤ ± 10 µm — Z: ≤ ± 10 µm
Positioning accuracyX/Y: ≤ ± 15 µm — Z: ≤ ± 15 µmMaximum speedX/Y: 1,300 mm/s — Z: 500 mm/s
Maximum accelerationX/Y: 1.3 g — Z: 0.5 gDual-head module accuracyW axis: ≤ 0.025 mm — U axis: ≤ 0.025 mm
Height measurementRange ± 5 mm — repeatability 1 µmMeasurement compatibilityDark objects detected; glass surfaces not detected
Vision systemPositioning by fiducial or by product appearance featureMax. camera field25.4 × 25.4 mm
On-the-fly alignmentUp to 300 mm/sConveyorSingle lane or dual lane (option)
Rail parallelism< 0.1 mm (difference between widest and narrowest point)Conveyor width adjustment40 to 205 mm
Workpiece tray flatness≤ 0.01 mmCertificationCE · ISO

Typical applications

Adhesive sealing and solder paste dispensing on camera modules Autofocus motor assembly: precision epoxy and underfill Bonding, potting or reinforcement of flexible circuits MiniLED and advanced LED encapsulation lines Cover bonding, Dam & Fill, vent bonding, adhesive dots on metal domes Solder paste dispensing on PCBs and chip underfill Complex multi-step bonding or protective bonding

Implementation

  1. 01

    Choosing the nozzle and mode

    Selection of the nozzle and dispensing mode suited to the fluid and pattern.

  2. 02

    Pilot recipes

    Launch of the first trial recipes on your parts.

  3. 03

    Vision tuning

    Camera-guided adjustment of placement.

  4. 04

    Locking in the MES

    Validated recipes are frozen and controlled from the factory system.

Trials on your own parts and fluids can be carried out in our laboratory. Discover our testing services

Let's talk about your application

A dispensing or dosing need? Let's try it on your parts.

Tell us which fluid you dispense, at what rate and with what tolerance: we will propose the right configuration, a detailed quotation and, if you wish, a trial on your own parts in our laboratory.

CDS Electronique · Bussy-Saint-Martin (77) · Mon–Thu 9am–6pm · Fri 9am–12pm