Product sheet
In advanced semiconductor manufacturing, sealing and protecting ASIC (application-specific integrated circuits) chips requires precise, reliable and perfectly controlled adhesive dispensing. The Mingseal GS600 series in-line vision dispensing and encapsulation machine is designed to meet these requirements on chip packaging and integrated component assembly lines.
It features a robust in-line conveyor that ensures smooth transfer of parts and precise encapsulation, without missing a single chip. It can be fitted with 1 or 2 dispensing heads to suit different adhesive types, volumes and cycle times. Its advanced vision modules provide high-resolution image recognition : each chip is located before dispensing begins.
Whether you produce ASIC chips for mobile devices, computing, automotive electronics or other components, the GS600 series delivers the reliability and efficiency needed to increase your output while meeting strict quality requirements.
Camera modules check the position of every chip: complete coverage and no part left unsealed.
Easily adapts to different sealing products, viscosities and production volumes thanks to a choice of valve configurations.
The in-line conveyor ensures smooth movement of parts and limits bottlenecks on the line.
Advanced image recognition and vision positioning for precise encapsulation of small, sensitive components.
The GS600M uses an in-line conveyor dispensing flow with integrated vision verification. It operates in single or dual lane, with MES connection for Industry 4.0 environments.
ASIC substrates enter through the loading module and move along the precision conveyor.
At the dispensing station, vision locates each chip on the fly, up to 300 mm/s, using a fiducial or the product's appearance.
The laser height sensor ensures the correct Z height before the sealing product is dispensed.
Camera modules check that each chip is fully covered.
Processed substrates leave towards the unloading module.
Working travel: the 380 × 610 mm area accommodates large PCB panels and multi-chip substrates. Check your panel dimensions.
Lane configuration: single lane suits small volumes or varied production; dual lane doubles the throughput for high-volume ASIC lines.
No-miss verification: in-line vision inspection after dispensing is essential for quality.
Lane width: the 40 to 170 mm adjustment covers most ASIC substrate sizes.
Factory integration: the MES connection and the automation of loading and unloading must match your existing line.
| Motion system | |
| Drive | X/Y: linear motor Z: servomotor + screw module |
| Max. dispensing area (X/Y) | 280 × 170 mm (single lane, with loading/unloading) 360 × 520 mm / 360 × 215 mm (single / dual lane, without loading/unloading) |
| Working travel (X/Y) | 380 × 610 mm |
| Repeatability (3σ) | X/Y ≤ ± 10 µm — Z ≤ ± 10 µm |
| Positioning accuracy | X/Y ≤ ± 15 µm — Z ≤ ± 15 µm |
| Maximum speed | X/Y: 1,300 mm/s — Z: 500 mm/s |
| Maximum acceleration | X/Y: 1.3 g — Z: 0.5 g |
| Correction system | |
| Vision positioning | By fiducial or by product appearance |
| On-the-fly alignment | Up to 300 mm/s |
| Laser height measurement | Measuring range ± 5 mm, repeatability 1 µm, sampling frequency 2 kHz |
| Conveyor | |
| Number of lanes | Single lane / dual lane |
| Rail parallelism | < 0.1 mm (difference between widest and narrowest point) |
| Adjustable width | 40 to 170 mm |
| Side push accuracy | ≤ 0.02 mm |
| Loading / unloading module | Loop, suspended or floor-standing, teaching on touch screen |
Trials on your own substrates and sealing products can be carried out in our laboratory. Discover our testing services
Let's talk about your application
Tell us which fluid you dispense, at what rate and with what tolerance: we will propose the right configuration, a detailed quotation and, if you wish, a trial on your own parts in our laboratory.
CDS Electronique · Bussy-Saint-Martin (77) · Mon–Thu 9am–6pm · Fri 9am–12pm
